StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU/GPU Thermal Grease Paste (SILVGREASE1)

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THERMAL PASTE: Metal oxide-based compound works with a heat sink to improve heat dissipation from CPUs and GPUs; High thermal conductivity provides increased heat transfer to heat sink; 5 pack (SILV5-THERMAL-PASTE) also available
THERMAL CONDUCTIVITY: Reliable performance in temperatures of -22F to 365F (-30C to 180C) with thermal conductivity of 3.195 W/m-K at 25 °C or greater; Ideal for servicing and maintaining desktop workstations and integrated chipsets with a heat sink
RESEALABLE: This tube contains 1.5g of paste sufficient for 4-6 applications, in a re-sealable applicator syringe that prevents drying between use; Ideal for Technicians and IT Professionals performing maintenance or servicing

$10.14


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Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.

THERMAL PASTE: Metal oxide-based compound works with a heat sink to improve heat dissipation from CPUs and GPUs; High thermal conductivity provides increased heat transfer to heat sink; 5 pack (SILV5-THERMAL-PASTE) also available
THERMAL CONDUCTIVITY: Reliable performance in temperatures of -22F to 365F (-30C to 180C) with thermal conductivity of 3.195 W/m-K at 25 °C or greater; Ideal for servicing and maintaining desktop workstations and integrated chipsets with a heat sink
RESEALABLE: This tube contains 1.5g of paste sufficient for 4-6 applications, in a re-sealable applicator syringe that prevents drying between use; Ideal for Technicians and IT Professionals performing maintenance or servicing
SAFETY AND RELIABILITY: This thermal paste is CE and RoHs certified for guaranteed safety and reliability; The compound contains 60% metal oxide and offers better thermal conductivity than standard heat pastes – Best suited for CPUs with TDP of up to 65W

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